TECHNOLOGY

Compact line for complete machining (drilling, punching, marking and plasma cutting) of middle and high thick plates in one handling.

The purely software-based solution is a new approach in which a processor carries out all automation tasks within a single-processor mode. The PC software is used for processing PLC and NC tasks.

• Cuts up to 65mm thick plate with the 400AMP high definition plasma
• Capacity to punch, drill, stamp mark number, scribe cleat locations and automatically unload processed parts.